Power bump placement

Place the power bumps (the flip-chip C4 - Controlled Collapse Chip Connection - bumps) on the C4 array grid (the hollow slots) to feed the mesh from the package. This block's power demand is not uniform: the dashed circles are high-current regions that draw far more, so for the same distance the droop there is worse. Bumps cannot land on a macro, which is a bump keepout.

All the bumps start piled in one corner, so most of the die is deep in the red.

• Peak IR (current times resistance) drop under budget - the worst point (marked with a crosshair) must come under budget. Put bumps on the high-current hotspots first, then spread the rest to cover the die and ring the macro keepouts. Match the bump density to the demand: more bumps where the current is high.

Drag each bump onto a grid slot, then Submit design for a score.